Micromachined Integrated Quantum Circuit Containing a Superconducting Qubit
T. Brecht, Y. Chu, C. Axline, W. Pfaff, J. Z. Blumoff, K. Chou, L. Krayzman, L. Frunzio, R. J. Schoelkopf
DOI 10.1103/PhysRevApplied.7.044018 · Physical Review Applied
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Abstract
We present a device demonstrating a lithographically patterned transmon integrated with a micromachined cavity resonator. Our two-cavity, one-qubit device is a multilayer microwave-integrated quantum circuit (MMIQC), comprising a basic unit capable of performing circuit-QED operations. We describe the qubit-cavity coupling mechanism of a specialized geometry using an electric-field picture and a circuit model, and obtain specific system parameters using simulations. Fabrication of the MMIQC includes lithography, etching, and metallic bonding of silicon wafers. Superconducting wafer bonding is a critical capability that is demonstrated by a micromachined storage-cavity lifetime of 34.3 μs, corresponding to a quality factor of 2×106 at single-photon energies. The transmon coherence times are T1=6.4 μs, and T2echo=11.7 μs. We measure qubit-cavity dispersive coupling with a rate χqμ/2π=−1.17 MHz, constituting a Jaynes-Cummings system with an interaction strength g/2π=49 MHz. With these parameters we are able to demonstrate circuit-QED operations in the strong dispersive regime with ease. Finally, we highlight several improvements and anticipated extensions of the technology to complex MMIQCs.
Source-reported materials — not catalogue approval
| Formula | Reported Tc (K) | Pressure (GPa) | Type |
|---|---|---|---|
| In Archive — visibility unverified Source-occurrence policy only; no material identity or catalogue acceptance is inferred from the formula. | — | Pressure not reported | unknown |
| Al Archive — visibility unverified Source-occurrence policy only; no material identity or catalogue acceptance is inferred from the formula. | — | Pressure not reported | unknown |
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