Superconducting transition of single-crystal tin microstructures
K. Yu. Arutyunov, T. V. Ryynänen, J. P. Pekola, A. B. Pavolotski
DOI 10.1103/PhysRevB.63.092506 · Physical Review B
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Abstract
Single-crystal superconducting microstructures have been fabricated. The resistances of tin whiskers were measured in a multiprobe configuration. Contacts were made of copper, gold, or niobium films using e-beam lithography followed by a lift-off process. Structures with normal metal probes showed unusual behavior: below the critical temperature of bulk tin, the resistance decreases in distinct steps and does not reach zero even when cooled down to 1 K. The origin of these phenomena is not clear but is likely related to a proximity effect.
Source-reported materials — not catalogue approval
| Formula | Reported Tc (K) | Pressure (GPa) | Type |
|---|---|---|---|
| Sn Archive — visibility unverified Source-occurrence policy only; no material identity or catalogue acceptance is inferred from the formula. | 3.78 | Pressure not reported | unknown |
| Nb Archive — visibility unverified Source-occurrence policy only; no material identity or catalogue acceptance is inferred from the formula. | 7 | Pressure not reported | unknown |
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