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Superconducting tunnel junction fabrication on three-dimensional topography via direct laser writing

Samuli Heiskanen, Ilari J. Maasilta

arXiv:2009.09749 · 2020-09-21 · arXiv: Superconductivity

T1theoretical

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Abstract

Superconducting junctions are widely used in multitude of applications ranging from quantum information science and sensing to solid-state cooling. Traditionally, such devices must be fabricated on flat substrates using standard lithographic techniques. In this study, we demonstrate a highly versatile method that allows for superconducting junctions to be fabricated on a more complex topography. It is based on maskless direct laser writing (DLW) two-photon lithography, which allows writing in 3D space. We show that high-quality normal metal-insulator-superconductor (NIS) tunnel junctions can be fabricated on top of a 20 $μ$m tall three-dimensional topography. Combined with more advanced resist coating methods, this technique could allow sub-micron device fabrication on almost any type of topography in the future.

Source-reported materials — not catalogue approval

FormulaReported Tc (K)Pressure (GPa)Type
Al

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—Pressure not reportedunknown
Nb

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—Pressure not reportedunknown
NbN

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—Pressure not reportedunknown
TaN

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—Pressure not reportedunknown
TiN

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—Pressure not reportedunknown

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