Development of Multi-Layer Fabrication Process for SFQ Large Scale Integrated Digital Circuits
Liliang Ying, Xue Zhang, Minghui Niu, Jie Ren, Wei Peng, Masaaki Meazawa, Zhen Wang
arXiv:2011.06272 · DOI 10.1109/TASC.2021.3065277 · 2020-11-12 · IEEE Transactions on Applied Superconductivity
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Abstract
We have developed a fabrication technology for the development of large-scale superconducting integrated circuits with Nb-based Josephson junctions. The standard fabrication process with 10 mask levels uses four metal layers including 3 Nb superconducting layers and a Mo resistor layer. The influence of deposition parameters on film stress, electrical properties, and surface roughness were studied systematically. High quality Nb, Al, Mo, and SiO2 films were successfully deposited for the subsequent fabrication of circuits. The circuit fabrication started with the fabrication of Mo resistors with a target sheet resistance Rsh of 2 Ome, followed by the deposition of Josephson-junction. The target critical current density Jc was set at 6 kA per cm2. The thicknesses and etch depths of the films were monitored during fabrication with on-wafer process-control-monitor (PCM) patterns for all the wafers.
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