Sn-InAs nanowire shadow-defined Josephson junctions
Amritesh Sharma, An-Hsi Chen, Connor P. Dempsey, Amrita Purkayastha, Mihir Pendharkar, Susheng Tan, Christopher J. Palmstrøm, Sergey M. Frolov, Moïra Hocevar
arXiv:2503.13725 · DOI 10.1021/acs.nanolett.5c02410 · 2025-03-17 · Nano letters
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Abstract
Interest in hybrid electronic devices for quantum science is driving the research into superconductor-semiconductor materials combinations. Here we study InAs nanowires coated with shells of $β$-Sn. The wires grow via the vapor-liquid-solid mechanism out from (001) InAs substrates along two orientations, forming a criss-crossing landscape. This allows us to define nanowire-shadow junctions during the low temperature Sn shell deposition by carefully choosing the deposition angle. We find that the Sn shells are uniform in thickness and the grains have a preferential in-plane epitaxial relationship with InAs. The interface between Sn and InAs is abrupt and we do not observe interdiffusion. In our nanowire devices, Sn induces a superconducting gap of order 600 $μ$eV, switching currents reaching values up to 500 nA, and critical magnetic fields along the nanowire of up to 1.3 T. These characteristics can be leveraged in the design of superconducting transmon qubits, parametric microwave amplifiers as well as for the investigation of triplet and topological superconductivity.
Source-reported materials — not catalogue approval
| Formula | Reported Tc (K) | Pressure (GPa) | Type |
|---|---|---|---|
| Sn Archive — visibility unverified Source-occurrence policy only; no material identity or catalogue acceptance is inferred from the formula. | 3.7 | Pressure not reported | unknown |
| Al Archive — visibility unverified Source-occurrence policy only; no material identity or catalogue acceptance is inferred from the formula. | 1.23 | Pressure not reported | unknown |
| Sn Archive — visibility unverified Source-occurrence policy only; no material identity or catalogue acceptance is inferred from the formula. | — | Pressure not reported | — |
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