Fabrication of Ag/Tl-Ba-Ca-CuO/CdSe nanostructure by electrodeposition technique
P. M. Shirage, D. D. Shivagan, L. A. Ekal, N. V. Desai, S. B. Mane, S. H. Pawar
arXiv:cond-mat/0305397 · DOI 10.1016/S0169-4332(01)00459-7 · 2003-05-16 · Applied Surface Science
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Abstract
Junction between metal, superconductor and semiconductor materials seems to be promising for their applications as the electronic devices, microelectronic devices and high power transmission. E-mail shpawar_phy@unishivaji.ac.in.
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