Epitaxial aluminium-nitride tunnel barriers grown by nitridation with a plasma source
T. Zijlstra, C. F. J. Lodewijk, N. Vercruyssen, F. D. Tichelaar, D. N. Loudkov, T. M. Klapwijk
arXiv:0711.2221 · DOI 10.1063/1.2819532 · 2007-11-14 · Applied Physics Letters
Active bibliographic source — not scientific approval
Bibliographic access preserves source history; it does not approve extracted materials or validate reported claims. Review warnings on each occurrence separately.
Abstract
High critical current-density (10 to 420 kA/cm^2) superconductor-insulator-superconductor tunnel junctions with aluminium nitride barriers have been realized using a remote nitrogen plasma from an inductively coupled plasma source operated in a pressure range of 10^{-3} to 10^{-1} mbar. We find a much better reproducibility and control compared to previous work. From the current-voltage characteristics and cross-sectional TEM images it is inferred that, compared to the commonly used AlO_x barriers, the poly-crystalline AlN barriers are much more uniform in transmissivity, leading to a better quality at high critical current-densities.
Similar papers
Anodization-free fabrication process for high-quality cross-type Josephson tunnel junctions based on a Nb/Al-AlO/Nb trilayer
similarity 0.87Fabienne Adam et al. · 2024 · arXiv:2403.01806
Source status unknown — claims are unverified
Are pinholes the cause of excess current in superconducting tunnel junctions? A study of Andreev current in highly resistive junctions
similarity 0.87Tine Greibe et al. · 2010 · arXiv:1009.1248
Source status unknown — claims are unverified
Stacked Josephson junctions for quantum circuit applications
similarity 0.87Alex Kreuzer et al. · 2026 · arXiv:2503.11437
Source status unknown — claims are unverified
Fabrication and characterization of Nb/Al-AlN /Nb superconducting tunnel junctions
similarity 0.86Alexey Pavolotsky et al. · 2025 · arXiv:2512.06994
Source status unknown — claims are unverified
Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer
similarity 0.86Achintya Paradkar et al. · 2024 · arXiv:2408.14655
Source status unknown — claims are unverified
Fabrication of stable and reproducible sub-micron tunnel junctions
similarity 0.86I. M. Pop et al. · 2011 · arXiv:1105.6204
Source status unknown — claims are unverified