Qubit-compatible substrates with superconducting through-silicon vias

K. Grigoras; N. Yurttagül; J. -P. Kaikkonen; E. T. Mannila; P. Eskelinen; D. P. Lozano; H. -X. Li; M. Rommel; D. Shiri; N. Tiencken; S. Simbierowicz; A. Ronzani; J. Hätinen; D. Datta; V. Vesterinen; L. Grönberg; J. Biznárová; A. Fadavi Roudsari; S. Kosen; A. Osman; M. Prunnila; J. Hassel; J. Bylander; J. Govenius

doi:10.1109/TQE.2022.3209881

Qubit-compatible substrates with superconducting through-silicon vias

K. Grigoras, N. Yurttagül, J. -P. Kaikkonen, E. T. Mannila, P. Eskelinen, D. P. Lozano, H. -X. Li, M. Rommel, D. Shiri, N. Tiencken, S. Simbierowicz, A. Ronzani, J. Hätinen, D. Datta, V. Vesterinen, L. Grönberg, J. Biznárová, A. Fadavi Roudsari, S. Kosen, A. Osman, M. Prunnila, J. Hassel, J. Bylander, J. Govenius

arXiv:2201.10425 · DOI 10.1109/TQE.2022.3209881 · 2022-01-25 · IEEE Transactions on Quantum Engineering

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Abstract

We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on the front and back sides of the chips. This resonator performance is on par with the state of the art for silicon-based planar solutions, despite the presence of vias. Via stitching of ground planes is an important enabling technology for increasing the physical size of quantum processor chips, and is a first step toward more complex quantum devices with three-dimensional integration.

Source-reported materials — not catalogue approval

Formula	Reported Tc (K)	Pressure (GPa)	Type
Ta Archive — visibility unverified Source-occurrence policy only; no material identity or catalogue acceptance is inferred from the formula.	—	Pressure not reported	unknown
Ta Archive — visibility unverified Source-occurrence policy only; no material identity or catalogue acceptance is inferred from the formula.	4.46	Pressure not reported	unknown
TiN Archive — visibility unverified Source-occurrence policy only; no material identity or catalogue acceptance is inferred from the formula.	—	Pressure not reported	unknown
TiN Archive — visibility unverified Source-occurrence policy only; no material identity or catalogue acceptance is inferred from the formula.	5.4	Pressure not reported	unknown