Residual resistance ratio of Cu stabilizer in commercial REBCO tapes

Abstract

Residual resistance ratio (RRR) of Cu stabilizer in REBCO coated conductor is an important design parameter for REBCO magnets. In this work, we measured RRR of electroplated Cu stabilizer in commercial REBCO tapes. Over 130 samples were measured for the quality assurance programs of REBCO magnet projects at the National High Magnetic Field Laboratory, USA (NHMFL). The average RRR value was above 50. In order to investigate the factors that influence RRR, several samples were analyzed by using scanning electron microscopy, secondary ion mass spectroscopy, and inductively coupled plasma mass spectroscopy. We found that, in our samples, RRR was strongly correlated with the grain size. We demonstrated that RRR was primarily determined by grain boundary resistivity. Lower RRR was also strongly correlated with higher concentration of chlorine impurity. This is explained by that higher chlorine impurity hindered the grain growth in the room temperature self annealing process resulting smaller grain. Smaller grain resulted in lower RRR. In addition, thermal annealing significantly enhanced RRR. An activation energy of 0.4 eV was obtained from the annealing experiment which corresponds to the activation of Cu grain growth.

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